Applications: Wire bonding
Assembly: Wire Bonder
Industry: Semiconductor
 
Description
•   Function
•   Carbon Fiber bracket
•   Light weight cross roller bearing
•   High acceleration
•   High rigidity– for better Wire Bonder X-Y Solution

Specifications
•   Stroke 90x90mm

X motor
•   Continuous force 200N (air cool)
•   Peak force 1000N
•   Moving mass 790grams

Y motor
•   Continuous force 140N (air cool)
•   Peak force 700N
•   Moving mass 610grams

Z-Axis:
•   Stroke +/- 4°
•   Max flux density between magnet 0.92T
•   Coil resistance 2.6ohm @ 25degC